We develop System on modules based around different processors. This gives us the capacity to make ultra fast complex designs with low cost and low risk for our customers. Compared with other modules in the market, our design fits the majority of this processor interfaces and reduces the necessary externals elements of most designs.
- Full BSP Linux Android
- Complete HW solution
- In House production
Technologies
- MICROCONTROLLERS AND MICROPROCESSOR DESIGN
- FPGA DESIGN
- HIGH SPEED BUSES
- ANALOG DESIGN
- RF DESIGN
- EMBEDDED LINUX
- REAL TIME OS
MECHANICAL SPECIFICATIONS
Dimensions
55mm x 70mm
- 2 120-pin connectors,
Mezzanine type, step 0.8mm,
board-to-board heights
(from 5mm to 16mm),
FCI 61082-121402LF compatible. - 4 M2.5 metallized holes.
Available
Development system
SCALABLE DESIGN
CPU (Single Core to Quad Core)
RAM: 256MB – 4GB (DDR3 & LPDDR3)
eMMC memory: from 4GB
Possibility of module customization and development
of Carrier adapted to specific needs
APPLICATIONS
- On-board equipment
- Human-Machine Interfaces
- Data acquisition systems
- Telecommunication and control systems
- Medical equipment
- Entertainment Systems
- Home Automation
- Security
- Gaming
- Transport
- Railway
TECHNICAL INFORMATION
Processor
NXP, Solo, Dual and
Quad Core ARM Cortex A9
up to 1.2 Ghz.
RAM memory:
256MB – 4 GB (DDR3 & LPDDR3)
eMMC memory:
From 4GB.
Graphic Interfaces
Control of up to 3 screens
simultaneous and independent
1 x HDMI with CEC and HPD, 2x LVDS 24 Bit
Ethernet
1 x Gigabit Ethernet PHY with physical output
for direct connection to a transformer
Interfaces
2 x 8-bit parallel camera bus
1 x UART CMOS, TX and RX output
3 x UART CMOS, TX, RX, RTS and CTS output
2 x SD interface
1 x USB HOST
1x USB OTG
2 x SPI, 2 independent signals (chip selects)
2 x I2C
2 x CAN Bus
1 x SATA (Depending on CPU configuration)
1 x PCIe x 1 Lane
1 x ESAI, digital audio interface
with separate clocks for TX and RX.
2 x PWM
8 x GPIOs
1 JTAG Debugging Interface
1 x Integrated I2C EEPROM memory
in the module with a unique MAC number.
5 Vdc power supply
OS
Linux, Yocto, LFS,
Buildroot, Debian
Others: on request
MECHANICAL SPECIFICATIONS
Dimensions
55mm x 70mm
- 2 120-pin connectors,
Mezzanine type, step 0.8mm,
board-to-board heights
(from 5mm to 16mm),
FCI 61082-121402LF compatible. - 4 M2.5 metallized holes.
Available
Development system
SCALABLE DESIGN
Cortex A9 single core or dual core CPU
Xilinx Z-7007S, Z-7014S, Z-7015 or Z-7020
RAM: 512MB DDR3L
eMMC memory (optional): from 4GB
qSPI memory: from 128MB
FRAM memory: 8KB
Possibility of module customization and development
of Carrier adapted to specific needs
APPLICATIONS
- On-board equipment
- Mixed Linux/Real time systems
- Data acquisition systems
- Signal processing
- Control systems
- Transport
- Railway
- Robotics
TECHNICAL INFORMATION
Processor
Xilinx single or Dual core Cortex A9 up to 866MHz.
RAM memory:
512MB DDR3L
Memory or Volatile
eMMC: From 4GB.
qSPI: from 128MB.
Registration memory:
FRAM memory of 8KB for storage
of records against power loss and restarts
Ethernet
1 x Gigabit Ethernet PHY with physical output
for connection to a transformer
USB
1 x PHY ULPI with USB 2.0 Host output
LEDs
3 x SW-configurable LEDs
Interfaces
15 x FPGA differential pairs:
Differential ADCs
Unipolar signals
Very high speed interfaces
Connection of displays or cameras
56 x FPGA signals on the connector
2 x UART CMOS
1 x CAN
1 x ADC
1 x I2C
1 x SDIO
1 x JTAG debug interface
1 x Integrated I2C EEPROM memory
with unique MAC number
OS
Petalinux-based software with the option of offering other OSes on demand.
TECHNOLOGIES
